Tepla 600

- Semi-Automatic RF Plasma System
- Can process up to 150mm wafers
- Used for photoresist stripping and surface cleaning, as well as etching silicon and its compounds
- Chamber Size: 245mm diameter, 380mm depth
- Chamber Material: ceramic
- ENI RF Generator: 0-600 Watt, 13.56 MHz
- Gases: 4 channels controlled by 4 MFCs
- MFCs: Brooks 5850 MFCs (professional rebuilt and calibrated)
- Computer: on-board, single card computer
- RS232 interface
- Software: up to 100 programs of 5 steps each can be entered
- Emergency Stop (EMO)
- Leybold D40 Vacuum Pump or equivalent (professionally rebuilt)
- Dimensions: 740mm x 624mm x 701mm + connections
- Weight: 135 kg (approximate)
- Electrical: 230V, 50/60Hz, 15A, 2kW