Tepla 300 PC Plasma Asher

Max Wafer: 200mm
System Dimensions: 41x30x75

Configuration:
Up to 200mm wafer capable,
Quartz Chamber,
2 Process Gas Inputs plus N2 Input

Tepla 300 Plasma Asher consisting of:
- Model: 300 PC Main System
- Manual wafer load plasma asher
- Designed for Wafer Cleaning and Descum
- Plasma Chamber: Quartz
- Plasma Chamber Dims: 245mm diameter, 380mm depth
- Plasma Generation: 2.45 GHz Max / 1.000 Watt Variable
- Gas Lines: N2 Gas Input and 2 Process Gas Inputs
- Motor Driven Drawer Unit
- Vacuum Pump
- Computer PC controlled
- Operators Manual for Tepla 300.

CONDITION:
Excellent Condition Guaranteed
Fully Reconditioned to Factory Specifications
6 Month Warranty and Specifications Guarantee
30 Day Right of Return