Perkin Elmer 4450 Sputter

Wafer Size: Small~8 inch
Wafer loading: Manual, with Load Lock
Cathodes: Delta Shape, 3 max
Sputter Methods: DC/RF; Diode/Magnetron
Gas Lines: 1~3 MFCs
Sputter Methods: DC/RF; Diode/Magnetron
Gas Lines: 1~3 MFCs

y Features
Process Proven for III-V substrates
Non-PLC (Smaller footprint / easy maintenance)
20 years proven sputter technology
New optimum AW-4450 System Control
Efficient DeltaTM cathode
Up to 3 pieces of DeltaTM cathode ports
High throughput operation
High Uniformity and Yield
DC, RF Sputter
Magnetron and Diode Sputter option
RF Etch and Bias are optional
Ultra Clean vacuum system
Load lock operation
UHV design
Flexible for development or production use
Full range of substrate sizes and shapes
Various pumping and power options
Co-sputtering option
Reactive Sputtering option