Perkin Elmer 4400 Sputter

Wafer Size: Small~6 inch
Wafer loading: Manual, with Load Lock
Cathodes: Circle Shape, 8″ & 4 max
Sputter Methods: DC/RF; Diode/Magnetron
Sputter Methods: DC/RF; Diode/Magnetron
Gas Lines: 1~3 MFCs

System Controller
Maintenance, Manual, Semi Automatic and Full Automatic operation modes
Automated calibration of all sub-systems
Troubleshoot to sub-assembly levels
Programmed comprehensive calibration and diagnostic functions
Recipe creation for full automatic wafer processing
Automatic decline of improper recipes and process data
Multi-level password protection
Storage of multiple recipes and system functions
Real-Time process data acquisition, display, analysis
Real-Time graphics use display
Process Data and Recipe storage on a hard drive
Easy TC vacuum gauge calibration
Positioning Deposition(optional)
GEM/SEC II functions (optional)