Allwin21 AW-1008 ([email protected])
AMERICA North (USA-Canada-Mexico)
Please visit our website for updated information at www.allwin21.com
Updated Brochure in2024:https://allwin21.com/wp-content/uploads/2024/05/Allwin21-Product-Brochures-Plasma-Asher-Descum-2024.5-1.pdf
Why Allwin21 AW-1008 Semiconductor front end plasma asher descum euqipment: https://allwin21.com/wp-content/uploads/2024/05/AW-1008-Plasma-Stripper-Asher.pdf
Brand: Allwin21
AW-1008 Plasma Stripper/Asher
Wafer Size: 3″ – 6″ Capability
Wafer Loading: 3-axis Robot
Plasma Power: Microwave
Type: Parallel/Single Wafer Process; Stand-Alone
Gas Lines: 1-4 Lines
Specifications:
Downstream Plasma. 8µ / min
1000W Microwave Power (1.25kW w/ Variable MW Power option available)
Small footprint. 32″w x 32″d x 64″h
75mm – 150mm wafer capability.
Up to 4 MFC’s.
End-of- Process (EOP) process endpoint detection.
Pressure control.
GEM/SECSII (option).
Floor or Through-the-wall design.
Allwin21 Corp. has been focusing on providing solutions and enhancements to Gasonics Aura 1000, Gasonics Aura 2000LL, Gasonics Aura 3010, Gasonics L3510 used plasma Asher Descum semiconductor process equipment, Gasonics AE 2001, Gasonics AE 2000LL used Plasma Etcher equipment. These OEM Asher semiconductor equipment have been used in productions and R&D since 1990′s. They have been proven to be a true “work horse”. Allwin21 Corp. can customize these OEM systems with Allwin21′s comparable integrated process control system with PC, solid robotic wafer transfer system (Video-1000 ; Video-3000/3010/L3510) and new critical components to achieve the goal of giving our customers a production edge with right cost.