Nikon NSR-S204B

Photo-lithography 248 NM DUV Scanner with photo-track
Version: 300 MM
Vintage: 01.06.2002

The equipmewnt has been professionally de-installed and
crated, and it is now located at the warehouse. Inspection is
welcomed by appointment.

Equipment condition: The equipment has
some functionality issues. However, the overall condition is
good. Please refer to the attached images showing recent
performance data of the scanner and the attached Cymer laser.

Recent tool performance data
Feb. 2020:
The real measured Dynamic Distortion results were (Raw data):
Max X = 0.006
Max Y = 0.007
Min X= -0.064
Min Y = -0.009
In case you would apply ideal compensation values
(Removed Scan Elements) the
achievable Dynamic Distortion could be
Max X = 0.008
Max Y = 0.009
Min X= -0.011
Min Y = -0.008

Please refer to the attached image file for more data from 2022.
Configuration notes: DUV lithography Scanner /
Cluster The wafer Track can be included if required
(TEL ACT 12 Double block)

The equipment has Shot problems.
The equipment has been kept in the cleanroom in
Standby since 1,5 years
The equipment's Laser is in working condition.
Here is a link to a video showing the laser on you-tube:-
Cymer ELS-6400 248 nm laser
Resolution ≦ 150 nm
NA 0.68
Exposure light source KrF excimer laser (248 nm wavelength)
Reduction ratio 1:4
Exposure field 25 × 33 mm
Alignment accuracy (EGA, |M| + 3σ) ≦ 35 nm

Overview
- 6" Reticle; 300mm Wafer, 3 & 6 o’clock
- 248nm Wavelength, Reduction Ratio 4:1, NA 0.68 (max)
- KrF Laser (Cymer ELS-6400), 25 x 33 mm2 Field Size
- Resolution: 180 nm
- Resolution RET 150 nm
- Manufactured: June 2002
Imaging:
- Projection Lens (4:1)
- Software Controlled Variable N.A. (0.55 - 0.68)
- 25 x 33 mm2 max. Exp. Area
- SHRINC Resolution Enhancement Technology
- Real Time focus/level sensor
- Chip (Table) Levelling
- MAC Real Time Lens Control
Light Source:
- KrF Excimer Laser (20 W, 2 kHz)
- Standard Beam Matching Unit (BMU)
Overlay:
- Laser Step Alignment (LSA)
- Field Image Alignment (FIA)
Material Handling:
- Air bearing wafer stage (linear motors)
- In-Line Track Interface (LHS)
- Robotic Wafer Loader Type III
- Non-contact Prealignment 2
- S204B Pin Wafer Holder (300mm, Lattice type, pre-owned)
- Reticle Loader (Nikon Standard Type)
- Reticle Size: 6” x 0.25” thick
Automation:
- Control Rack
- System Computer with MCSV Operation Software
(non-transferable license)
- PPDSX Software (Job server software) & 1x S204B connection license
- Job Cascading Software
- NEST-A computer
Metrology Utilities / Software:
- Aerial Image Sensor (AIS)
- TTL Focus Calibration (TTL-FC2)
- Measurement & Evaluation Software
(MES, requires MF test reticle)
- Maintenance Tool Software
- GCM Software (Grid Compensation for Matching)
- CDP Software (Continuous DOF Expansion Procedure)
System Structure:
- Main Unit
- Active Vibration Isolation System (AVIS)
- Nitrogen Purge
- Chemical Filters
- Environmental Chamber
Options included
System Structure:
- PL purge
- Lamp Signal Tower
Material Handling:
- Pellicle Particle Detector (PPD)
- Barcode Reader (BCR)
Imaging:
- RET illumination apertures
Software:
- Online Software (GOCS)
Metrology Utilities:
- Test Reticle, R2504HA
- Test Reticle, R2504HB
- Test Reticle, R2504HDIS
- Test Reticle, R2504HMF
- Test Reticle, R2504HCD
General:
- CE Marking

Known Performance Problems
- Stage SYNC improvement necessary – alignment problems inter field
- Intermittent shot failures (single shots) during exposure
- Exchange RL robot and fork (most probably) necessary
- Change of chemical filters necessary