Mycronic PI PICO 3D SPI

DOM: 12/19/2022
3D Vision - 80 Mpixel 3D system (16 cameras, 4 projectors):
Distortion free 3D triangulation system
High power RBG LED lighting for 3D Color Image
-15 µm resolution
-Max. paste height measurement: 400 µm

Hardware:
-Min. PCB dimensions (L x W): 50x50 mm / 2" x 2"
-Max. PCB dimensions (L x W): 533 x 533 mm / 21" x 21"
-PCB thickness range: 0.1- 5 mm.
-Edge clearance: 3 mm.
-Max. PCB warp : +/- 5 mm.
-Embedded photometric and geometric calibration tools.
-Standard conveyor length: 1000 mm

Measurement - Insufficient paste, excessive paste, bridge,
missing paste, shape deformity:
-Volume, height, area, deposit offset, global offset.
-User defined defect created by a meta-rule.
-eSPC including X-R charts, process signature,
manual close loop tools.
-Power supply - 100-240 VAC / 16 A, Single Phase, 60 Hz
-Size (W x D x H) & weight - 1000 x 1296 x 1932 mm, 430 kg

Cycle time examples:
-PCB 150x175mm (L x W): 14.5 s
-PCB 240x175mm (L x W): 26.5 s