Gasonics

Gasonics Aura 2001 Etcher

Single wafer down-stream isotropic etch system Configurable for 75mm, 100mm, 125mm, and 150mm Wafer Sizes Front and backside etch GaSonics AE2001 Etch System Microwave Downstream Etcher Configurable for 75mm, 100mm, 125mm, and 150mm Wafer Sizes Cassette to Cassette wafer handling Gasses: 1) NF3, 2) CF4, 3) HE, 4) O2, PURGE, N2 (VCR Fittings) No RF damage (?0.1 VOLT CV SHIFT) Front and backside etching Variable platen temperature Alumina (ceramic) Plasma Tube Fluoirne compantible chamber SECS II interface Multiple step process capability Stand alone / floor standing model Etch rates and throughputs: BPSG (2500A etch) >4000 A/min 40wph TEOS (2500A etch) >2000 A/min 25wph LTO (2500A etch) >2000 A/min 25wph Selectivity to photoresist >20:1 Uniformity (within wafer) 100mm *