Used Semiconductor Equipment

Microscope Configuration Brightfield & DIC Illumination Type Xe Reflected Light Eyepieces Model KPL-W Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Prober Version: 300 mm Vintage: 01.05.2006 De-installed, warehoused. Inspection WITH POWER-UP DEMONSTRATION i Year(s) : 2006 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

WAFER FILM THICKNESS MEASUREMENT SYSTEM Vintage: 01.06.1991 KLA-Tencor Prometrix Film Thickness Probe W/ FT-65 Year(s) : 1991 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

ENDURA IMP Ti/TiN PVD 200 mm SNNF Wide body L/L HP Robots 2 x OD 2 x PCII 2 x IMP TiN 1 x IMP Ti 2 x CTI 96 Year(s) : 2000 Location : EUROPE (Western and Northern)

Price : On request

It can be used for both mask cassettes and wafer cassettes. There are 2 EPROM chips with this indexer. 1st E Location : EUROPE (Western and Northern)

Price : On request

Microwave plasma batch system Autoload PC Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Max. 12 inch, has NCS, has BBD Working condition Year(s) : 2005 Location : ASIA (North East)

Price : On request

Semi Automatic Dicing Saw Location : ASIA (North East)

Price : On request

Dicing/Cutting/Slotting various wafers Location : ASIA (North East)

Price : On request

Fully Automatic Dicing Saw Location : ASIA (North East)

Price : On request

Cut speed 0.1 ~ 450 (mm/s) Y-axis Useable stroke 210 (mm) Indexing step 0.0002 (mm) Position accuracy (cumula Location : ASIA (North East)

Price : On request

Position accuracy (cumulative pitch error) less than 0.005/160 (mm) Position accuracy (single pitch error) le Location : ASIA (North East)

Price : On request

Dicing/Cutting/Slotting various wafers Location : ASIA (North East)

Price : On request

Equip Name : ODSlicing Systems Workpiece Dimensions(mm) : 120x60x210 Max. travel X 250mm Y 160mm Z 105mm Location : ASIA (North East)

Price : On request

Z-axis Maximum stroke (mm) 7.2 (for ø 2" blade Moving resolution (mm) 0.00025 Repeating accuracy (mm) 0.001 Ma Location : ASIA (North East)

Price : On request

Workpiece handling size : ø152.4 mm(ø6") (max. diameter) 1.5 kW Synchro SpindleTM (air bearing spindle) X - a Location : ASIA (North East)

Price : On request

Cutting water 0.2 4.0 (L/min) Cooling water more than 1.5 (L/min) Duct required suction 2.5 5 (m3/min) Machine Location : ASIA (North East)

Price : On request

The Nanospec 210 is a wafer tester that has a film thickness measurement system. It has a 100 angstrom resol Location : AMERICA North (USA-Canada-Mexico)

Price : On request

The Sloam M-100 wafer tester has an interferometer, which measures wafter thickness by optical fringes. This Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Measurement Display Range … 200 A to 655,000 A (20nm to 65,000nm) Vertical Resolution … 5A (.5nm) Scan Length Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Microscope Configuration Brightfield Illumination Type Reflected Light Binocular Angle 45° Eyepieces Mo Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Microscope Type Microzoom Multiple Objectives Models Bausch and Lomb 2.25 X 0.04 N.A. 8 X 0.15 N.A. 25 X 0.3 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Exterior Dimensions Width 38.000 in (96.5 cm) Depth 25.750 in (65.4 cm) Height 72.000 in (182 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

VERTICAL FEED WEDGE BONDER INCLUDES STEREO ZOOM OPTICS good condition Location : EUROPE (Western and Northern)

Price : On request

Microscope for machines (without stand) Objective: Nikon G-AL 0,29 x Oculars: 20 x Illumination: up to 29 x o Location : EUROPE (Western and Northern)

Price : On request