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Used Semiconductor Equipment

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1

Features: Flexible range. Capable of 1 to 100W operation Greater stability Reproducible conditions Location : AMERICA North (USA-Canada-Mexico)

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Etcher Type Barrel Rated Power Output 600 Watts Reactor Center Cylindrical Reactor Center Size Depth 1 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Number of Photoresist Develop Stations 1 Number of Phot Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Specifications: Resolution: 1µm Full range accuracy (at 20°C): 3µm over 25mm Max allowable preset value: Location : AMERICA North (USA-Canada-Mexico)

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Description: Other Information Wafer Size: 4 to 8" Tape Tension: Programmable Cycle Time: 30 seconds for a 6 Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System Cryo Pumped Load Lock Included No E Beam Power Supply Power Supply Type Solid State Hig Location : AMERICA North (USA-Canada-Mexico)

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Description High Volume Evaporator Vacuum System Cryo Pumped Load Lock Included No E Beam Power Supply Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 100 mm Set Size 100 mm Other Information Chucks:2"-3"-4" Po Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System Cryo Pumped Load Lock Included Yes Number of RF Etch Cathodes 1 Substrate Heaters Yes Residu Location : AMERICA North (USA-Canada-Mexico)

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Description PECVD TEOS with Load Lock Wafer Size Range Maximum 200 mm Process PECVD & TEOS Controller T Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 200 mm Process PECVD/Plasma Etch/Reactive Ion Etch Controller Type Microproces Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 100 mm Mask Plate Size 5'' x 5'' Alignment Year(s) : 2001 Location : AMERICA North (USA-Canada-Mexico)

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Rated Power Output 1250 Watts Chamber Construction Aluminum Chamber Size Width 14.75 in (37.47 cm) Location : AMERICA North (USA-Canada-Mexico)

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8300 Weight 36 lb (16 kg) Location : AMERICA North (USA-Canada-Mexico)

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Eutectic Die Attach System Location : AMERICA North (USA-Canada-Mexico)

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Etcher Type Planar - Magnetron Rated Power Output 4000 Watts Reactor Center Rectangular Reactor Center Size Location : AMERICA North (USA-Canada-Mexico)

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Xray Source Specifications X Ray tube: 47KV @ 1ma Mo anode Beam size: 1.5 Mill/40-45 Micron Resolution: 100 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 150 mm Process Chlorine Etch Loadlock Loadloc Year(s) : 2003 Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Minimum 50 mm Maximum 200 mm Set Size 150 mm Process Silicon Etch Bosch Process Loadlo Location : AMERICA North (USA-Canada-Mexico)

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Maximum 100 mm Process Plasma etch Controller Type Microprocessor Controller Type End Point Detection Yes Location : AMERICA North (USA-Canada-Mexico)

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Vacuum System None Vacuum System Chamber made up of the 8" CF 4-way cross, M/N: 600-4T, 304SS 8" CF Door/V Location : AMERICA North (USA-Canada-Mexico)

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Description In-Line Sputtering System Vacuum System Diffusion Pumped Load Lock Included Yes Power Requireme Location : AMERICA North (USA-Canada-Mexico)

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1

Binocular Angle Variable Eyepieces Model N/A Magnification 16 X Focusing YES Magnification Range Location : AMERICA North (USA-Canada-Mexico)

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Microscope Configuration Brightfield Illumination Type Xe Reflected Light Binocular Angle 60° Eyepieces Location : AMERICA North (USA-Canada-Mexico)

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Polarizer YES Analyzer YES Condenser YES Illumination Power Volts: 6 Watts: 15 Illumination Power Tran Location : AMERICA North (USA-Canada-Mexico)

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You can find used Semiconductor Equipment on Wotol

For second hand Semiconductor Equipment we have Wafer Equipment, Wafer Handler & Robots, CVD Equipment, Wet Bench, Lithography & Photoresist, Plasma Etcher / Asher, Dicer & Scriber, Grinding, Lapping & Polishing, Component Counters/Tapers, Dry Pump, Bonder, Metrology and inspection equipment. The main manufacturers for used Semiconductor Equipment are KLA-Tencor, Plasmatherm, AMAT, TEL, Disco, Karl Suss, Canon, Semitool, Hitachi, Nanometrics, Nikon, Applied Materials, Tegal, Varian.

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