Used Semiconductor and PCB Manufacturing
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Tool Status: Connected Wafer Size: 300 mm Asset Description: DESPATCH Bake-out Cabinet Oven CIM: NONE Proc Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsCATHODES: 2 magnetron targets 200mm diameter. SUBSTRATE TRANSPORT LOAD LOCK: for 150mm diameter substrates. SU Location : EUROPE (Western and Northern)
Price : On request
More detailsHousing dimensions: B T 930 x 1565 x H 1840 (mm) Observation window: Width x height 300 x 540 mm Nominal volta Year(s) : 1992 Location : EUROPE (Western and Northern)
Price : On request
More details336 Clean Room Oven Came from major fab and in good condition. Temp Range: 250C / 482F Line Volts 240V / 1PH / Location : EUROPE (Western and Northern)
Price : On request
More details- 12" input, 8" output - seems to be functional (video available) - currently warehoused - photos attach Location : EUROPE (Western and Northern)
Price : On request
More detailsDeep Access 90° Feed Wedge Wire Bonder Location : EUROPE (Western and Northern)
Price : On request
More detailsBonder (s/n 12723), which is currently set up with the Wedge Bond Head with 90° Feed Deep Access Clamps, makin Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Thin Film Stress Measurement System Year(s) : 2004 Location : EUROPE (Western and Northern)
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More detailsInnolas Wafermarker Wafermarker C3000DPS Marking for 300mm Wafers Wafer Size Range Minimum 200 mm Maximum 3 Year(s) : 2002 Location : EUROPE (Western and Northern)
Price : On request
More detailsconsole with keypad controller Free angle stand with manual X,Y,Z and theta rotation of stage Zoom lens 150-8 Location : EUROPE (Western and Northern)
Price : On request
More detailsPhotoresist Year(s) : 2013 Location : EUROPE (Western and Northern)
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More detailsVoltage: 208AC Phase: 1 Phase, 4 Wire Full Load Current: 15 Amps 50/60 Hz Location : EUROPE (Western and Northern)
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More detailswafer Fabrication Year(s) : 1996 Location : EUROPE (Western and Northern)
Price : On request
More detailsTrias CVD PECVD-Oxynitride Year(s) : 2008 Location : EUROPE (Western and Northern)
Price : On request
More detailsSDP-ALD NIT 12 Thin Film ALD SiN/SiO Wafer Size 12 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Thermal Shock Tester Location : EUROPE (Western and Northern)
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More detailsIPS AKRA CVD Ti/TiN Year(s) : 2010 Location : EUROPE (Western and Northern)
Price : On request
More detailsProcess: Thin Film Stress Measurement System Year(s) : 2007 Location : EUROPE (Western and Northern)
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More detailsConfiguration: The Hanmi Trim and Form machine currently has Die sets for SSO Products For QFN package new t Year(s) : 2014 Location : EUROPE (Western and Northern)
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More detailsOven Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer Size Range Minimum 100 mm Maximum 200 mm Year(s) : 2000 Location : EUROPE (Western and Northern)
Price : On request
More detailsWafer size: 12" Process: Etch OCD Measuring Location : EUROPE (Western and Northern)
Price : On request
More detailsDispenser with Auto focus Camera Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsIntel Core2Duo Industrial Desktop PC, Software & Dell 20" HD LCD Monitor, Mouse, Cable & Kit for Dage 4000 Mul Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsAL wire Bonders Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14