Tencor HRP220

Tencor HRP220 Step Height Measurement Sytem

Wafer Size 8"
Measurement Capabilities for meeting the requirements of 0.18 um technology
Especially well suited for such applications as metal and inlaid metal CMP,and STI(shallow trench ioslation),post CMP
Total wafer flatness measurement with better than 1 nm vertical resolution.
- Vintage : 2000
- Wafer size : Up to 200mm
- Cassette to Cassette capability with Flat & Notch alignment
- Scan method: Moving stage
- Scan length: 200mm
- Camera views : Low/High
- Micor Head Type : MH3 LF
- Stylus (Single Black) : Submicron stylus / 0.1um Tip radius / 85 degree
- Video Hadware : Orion
- OS : Windows NT
- S/W Version : Profiler V6.5
- Options (Included) :
3D Analysis / Combine Statistics / Pattern Recognition / Sequence / HPPC/HPPM