Used Grinding, Lapping & Polishing
51 resultsM250 VSE I.S. EXP Laboratory Mini Bead Mill.The Eiger Machinery Laboratory Mini Mill Model M250 VSE EXP is a s Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPower Requirements 240 V 2.0 A 50/60 Hz 1 Phase Exterior Dimensions Width 14.000 in (35.6 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsHigh density, cast iron radially serrated lap plate 12” O.D. x 3” Includes: Masterflex L/S Economy Variable-Sp Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsHigh density, cast iron radially serrated lap plate 12” O.D. x 3” Includes: Masterflex L/S Economy Variable-Sp Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGrinding/polishing machine with RotoForce-4 head. The head has 6 spaces for samples, diameter disk: 250 mm, 15 Year(s) : 1999 Location : EUROPE (Western and Northern)
Price : On request
More detailsMachining: Pellet/Polishing machine Year(s) : 2005 Location : ASIA (North East)
Price : On request
More detailsPolisher Grinder with Vector LC Power Head. Buehler Metaserv 3000 single plate automatic polishing machine wit Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFully-Auto LED Wafer Prober Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsSW-08 Year(s) : 2010 Location : ASIA (North East)
Price : On request
More detailsWafer Polishing Machine Year(s) : 2011 Location : ASIA (North East)
Price : On request
More detailsGAN Grind Machine Year(s) : 2012 Location : ASIA (North East)
Price : On request
More detailsDFG-83H/6 Description Back side grinder Year(s) : 1994 Location : ASIA (North East)
Price : On request
More details24B Description Polisher Year(s) : 2000 Location : ASIA (North East)
Price : On request
More detailsTISI ID 150901-48 Manufacturer Semitool Model Spectral Description Poly Strip Wafer Size 200mm Vintage 7 Location : ASIA (North East)
Price : On request
More detailsTISI ID 150917-200 Manufacturer DISCO Model DFG8140 Description Back side polisher DFG8140 Wafer Size 8" Location : ASIA (North East)
Price : On request
More detailsTISI ID 151013-223 Manufacturer SPEEDFAM Model 32 DPAW Description Wafer Polishing Machine Location : ASIA (North East)
Price : On request
More detailsIt is now deinstalled. The tool was installed and initialized before being deinstalled due to a project canc Year(s) : 2007 Location : EUROPE (Western and Northern)
Price : On request
More detailsSemi-Automatic Grinder Polisher Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details13554 Cross Section Polisher Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsCross Section Polisher Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details15 WITH 3 RINGS, AND SLURRY PUMP Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecifications: Resolution: 1µm Full range accuracy (at 20°C): 3µm over 25mm Max allowable preset value: Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSpecifications: Workpiece material: Glass Max substrate: 300mm X Axis Specifications: Stroke: 300mm S Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsGeneral Specifications: Table diameter: 300mm Max. workpiece size: 400mm dia x 200mm H Table revolution speed: Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSHODA MVC-630BII Location : EUROPE (Western and Northern)
Price : On request
More detailsYou can find used Grinding, Lapping & Polishing on Wotol
The main manufacturers of Grinding, Lapping & Polishing are Disco, Strasbaugh, Speedfam, Logitech, Lapmaster, Semitool, Buehler, Ebara, Okamoto, Peter Wolters, AMAT, Harig, Premier Mill, Struers, ABB, Advanced Imaging, Branson / IPC, DNS, DS Precision, Fujikoshi, GMN, Leco, NEWLONG, Nitto, Polyflow, Schmoll, Seiko Instruments, Telmec , Ultron
The main model Polyflow S412, HR8500-II, 6EC, 7AA,EPD 300X, Harig EZ SURF, SSG 800 HT, 6DF-SP, 15, UH114, SL13.6, MPS 400, MK II-8, S-LM-116G, OFL-11, Q150GB , 24B, PP5, 1010, Mirra OnTrak, ST260D, DFP8140, S16B, GNX-300, DFG840HS, Rotopol 21,12, MiniMet, Mill NETZSCH, SG-1000HR, 10” web coating.
HS Code 8486 10 50 for Grinding, polishing and lapping machines for processing of semiconductor wafers