Strasbaugh 6EH nTrepid DIWO CMP Tool

It is now deinstalled.
The tool was installed and initialized before being
deinstalled due to a project cancellation.
The Strasbaugh 6EH nTrepid DIWO CMP Tool will
be released in late 2020.

Configuration: Silicon oxide, Poly-Si, a-Si Wafer: 150mm
Status: Deinstalled, in storage.

Condition: Tool was just initialized in fab,
when tool was deinstalled due to cancellation of project.
Tool in excellent condition and never put into production,
like new.

nTrepid is a 300-mm technology based fully automated,
dry-in wet-out (DIWO),
chemical-mechanical wafer polishing system.
Wafers will enter the system dry and be removed after
polishing in a wet state.
The system has two main sections: the polishing and
front end module (FEM) sections.
Tables and turrets are technically prepared in
a way that allow an upgrade of the tool up to 300-mm-wafers.
nTrepid is a fully automated, dry-in wet-out (DIWO),
chemical-mechanical wafer polishing system.
Wafers will enter the system dry and be removed after
polishing in a wet state.

The system has two main sections: the polishing and
front end module (FEM) sections.
The polishing section has load and unload stations,
two main polishing platens, rinse station, and buff table.
The two main tables have slurry and
deionized water delivery and pad conditioning systems.
The buff table has DIW delivery system.
Two spindle assemblies rotate about a central turret and
use wafer carriers to move the wafers to each station per
pre-programmed flows.

User-specified recipes are executed at each station for
polishing and rinsing the wafers.
The system will utilize an interfaced endpoint detection
system to monitor film transition and
thickness during polishing on the main two tables.

The FEM section provides the automatic input and
output location for wafers entering and exiting the system.
It contains the following wafer stations: Open cassette loaders,
wet wafer output basin with cart interface mechanism,
wet/dry transfer station, and wet buffer station.
A robot is used to move wafers to and from each station,
as well as into and out of the polishing section.

Wafers in cassettes are loaded into the machine at
the OCL’s and exit the machine in cassettes in
the wet output basin.
A cart is used to dock with the machine for
wet basin insertion and removal.
The wet buffer provides temporary wafer storage to
allow continuous operation when the wet basin is
not available or is being replaced.

Wafer Size Capabilities:
150mm round wafers - 1 Flat only,
Flat length = 57.5mm +/- 2.5mm
Wafer thickness #1 = 680 microns +/- 15 microns
Wafer thickness #2 = 380 microns +70/-10 microns

nVision Endpoint Detection:
Tables 1 and 2 are equipped with following types of
endpoint detection:
> Optical (using Smartpad) / Table motor current /
Pad temperature
Spindles A and B are equipped with
spindle motor current endpoint

Electrical
208 Volt / 3 Phase / 50 to 60 Hertz
Main circuit breaker: 150 Amps
FLA (Full Line Amperage): 80

Tool Size:
Length x Width = 11ft-11in x 6ft-7in, 79 square feet
(3.64x2.02 meters, 7.35 meters^2)
Height = 7ft-8in (2.30 meters)
Weight: 5000 Kg

Computing Platform:
Industrial PC running Windows XP and
Adventa ControlWORKS for Graphical User Interface,
recipe editing and execution, event scheduling,
and material tracking
Giddings and Lewis Programmable Logic Controllers (PLC’s) for
real-time movement control