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Used Bonder

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1

VERTICAL FEED WEDGE BONDER INCLUDES STEREO ZOOM OPTICS good condition Location : EUROPE (Western and Northern)

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This West-Bond 7400B 45° Feed Manual Wedge Wire Bonder (s/n 12422) looks to be in good cosmetic condition, s Location : EUROPE (Western and Northern)

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This West-Bond 7700B Gold Ball Wire Bonder looks to be in good cosmetic condition, showing some signs of wear Location : EUROPE (Western and Northern)

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The Westbond 7416 is a thermocompression wedge bonder. Includes heated tool, heated workholder and stereo zo Location : AMERICA North (USA-Canada-Mexico)

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Capable of thermo compression, fusion or anodic wafer bonding Bond chamber for small pieces up to 150mm wafer Location : AMERICA North (USA-Canada-Mexico)

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Wafer Size Range Maximum 200 mm Condition Like New Year(s) : 2012 Location : EUROPE (Western and Northern)

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Condition Fair Weight 220 lb (100 kg) Exterior Dimensions Width 17.717 in (45.0 cm) Depth 21.654 Year(s) : 1997 Location : EUROPE (Western and Northern)

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Other Information Power Supply : 230 VAC Power Consumption : 2,3 KVA Exterior Dimensions Width 48.228 Year(s) : 2007 Location : EUROPE (Western and Northern)

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Manufacturer BESI Other Information Power Supply : 200 - 415 VAC Power Consumption : 10 KVA Condition Good Year(s) : 2006 Location : EUROPE (Western and Northern)

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Power Supply : 99 to 240 VAC Power Consumption : Max 1500 W Power Requirements 240 V Year of Manufacture 201 Year(s) : 2015 Location : EUROPE (Western and Northern)

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Condition Good Weight 1,301 lb (590 kg) Exterior Dimensions Width 42.323 in (107.5 cm) Height 75 Year(s) : 2006 Location : EUROPE (Western and Northern)

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Other Information Power Supply : 100 - 240 V AC Power Consumption : 2,2 KVA Condition Good Year of Manufact Year(s) : 2004 Location : EUROPE (Western and Northern)

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Condition Good Weight 1,301 lb (590 kg) Exterior Dimensions Width 42.323 in (107.5 cm) Height 75 Year(s) : 2006 Location : EUROPE (Western and Northern)

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Condition Good Weight 1,609 lb (730 kg) Exterior Dimensions Width 28.346 in (72.0 cm) Height 62. Year(s) : 2015 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 74.803 in (190 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Condition Good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height Year(s) : 2010 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 61.024 in (155.0 cm) Depth 47.244 in (120.0 cm) Height 72.047 in (1 Year(s) : 2008 Location : EUROPE (Western and Northern)

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Condition Very Good Year(s) : 2007 Location : EUROPE (Western and Northern)

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Bonder S/N: 099 117 Vac, 12.1 A, 1 Ph, 50/60 Hz Location : AMERICA North (USA-Canada-Mexico)

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Bonder Location : AMERICA North (USA-Canada-Mexico)

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117 Vac 12.8 A 1 Ph 50/60 Hz Location : AMERICA North (USA-Canada-Mexico)

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Bonder Model 1484 Location : AMERICA North (USA-Canada-Mexico)

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Heavy Wire Bonder Location : AMERICA North (USA-Canada-Mexico)

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Bonder Location : AMERICA North (USA-Canada-Mexico)

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Bonder Location : AMERICA North (USA-Canada-Mexico)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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