Plasmatherm SLR 770 ICP

Single Process Chamber with SLR (Shuttle Lock Transfer) Load Lock
Manual Load with Load Lock Handling Currently Configured for 4” Wafers
Ceramic Wafer Clamp with Helium Backside Cooling System
Gas Distribution Box with 5ea Gas Channels
ENI ACG-6 RF Generator: 600W @ 13.56MHz
ENI Automatic Matching Network
RFPP RF20M RF Generator: 2000W @ 2.0MHz
RFPP Automatic Matching Network
Six Zone Chamber Heater with Temperature Controller
LEYBOLD 900 Turbo Pump with Mag 1000 Controller
MKS ITR Ion Gauge Controller
VAT Gate Valve with PM-5 Controller
Mechanical Roughing Pump
NESLAB HX-75 Chiller
Electrical Disconnect Box - 208V, 60Hz, 3 phase

Wafer Size Range
Minimum 75 mm
Maximum 200 mm
Set Size 100 mm
Process Inductively Coupled Plasma Etching
Controller Type PC Controller Type
End Point Detection Horiba Jobin-Yvon
Loadlock
Loadlock Yes/No YES
Number of Gas Inputs Five Gas
Chillers
Number of Chillers 1
Chiller #1Manufacturer/Model Neslab HX-75