Plasmatherm SLR 740

Dual Chamber RIE / Plasma etch
Version: 200 mm
Vintage: 01.04.1999
The LH Chamber is Standard, the RH chamber is also RIE,
but with adjustable top electrode gap.
(similar to old ECR config.)
Both chambers can work also as PE (Plasma Etch-Top power).
RIE or PE is switched by software.
One Chamber has a Low pressure feature with
TMP .the other one has no TMP,i.e just working med.
Vacuum process using the rough pump
(but has an option for adding TMP).
Each chamber has 8 Gas Channels (with 8 MFCs each).
see attached XLS file.
System is configured for European power rating, i.e 3 phase 400v.

The system is currently up and running so is in fair condition.

The equipment will include : 1 Chiller, 1 Process Rough Pump ,
1 LoadLock pump (oil).

MFC CONFIGURATION:-