Nova NOVASCAN 3090

CMP metrology system
Version: 300 mm
-De-installed, warehoused. Can be inspected by appointment.
-Has CE mark
-Includes interface head, computer

The Novascan 3090 system is an
advanced CMP metrology platform for
all process steps such as Poly, STI,
Tungsten (W) plugs and Copper interconnect.
That includes, among other, oxide residue and
Step-height for STI, profiling for Tungsten plugs,
and residue detection, erosion and MLT (Metal Line Thickness)
for copper interconnect process.

The NovaScan 3090 is based on Nova's earlier field proven
technology platform, the NovaScan 3060 system.
NovaScan 3090 is integrated in the exact same configuration as
the NovaScan 3060 system, thus offering customers an
easy upgrade path. Equipped with a single polarized channel,
from Deep-UV to Near-IR, the NovaScan 3090 supports the
measurement of solid areas, 2D structures and
enables 3D shape characterization.
The system provides real-time measurement of thickness and
shape of dielectric materials and for
a variety of Low-K materials.

The NovaScan 3090 delivers the measurement capability
needed to control high-end 65nm and 45nm CMP applications.
The unmatched MAM time of NovaScan 3090,
the dynamic precision and tool-to-tool matching,
along with built-in high reliability, all offer our customers a
production worthy tool covering a wide range of
metrology solutions, enabling Wafer-to-Wafer process control,
without affecting the process tool's overall throughput.