Manncorp SV350L Automatic IGBT Power Module Assembly

XY Placement Accuracy ± 10μm (±0.3°)
XY Resolution 0.001mm/step
Placement Heads 4 Heads / 6 Heads (pitch = 25mm)
Placement Capacity (μph) Max. 2,200 / Max. 2,600
Dispensing System (Optional)
High precision dispensing system + Musashi MC-5000XII controller
or High precision dispensing system + BCB KD-65 controller
Conveyor System Multiple Segment with Independent Driver
Size of Carrier Max. 460mm x 350mm x 20mm (Thickness = Carrier + Object)
Conveyor Through Left to Right
Feeding Forms Wafer Flange, Tray Form, & Tape Feeder is available
(1) Auto-Wafer Changer
Selectable 12" / 8" / 6" Wafer Die Flange auto-loading (12" is optional)
for dies pickup area max. 200 x 200mm on flange
8" to 6" / 12" to 6" Wafer Flange Adapter is available (optional)
Flange Cassette capacity is max. 25 pcs and
support max. 25 types of wafer flange auto-loading and placement
Wafer Die map-data is available to system programming
(2) Auto-Tray Changer
Each Tray Cassette with 8 slots for tray carriers
Size capacity up to 250mm x 120mm in each tray carrier,
or two pieces of 120mm x 120mm waffle tray place on,
and enough carrier clearance for max. 10 mm height of
component placing
Support max. 8 types of (tray) components for
auto-loading and placement
(3) Tape Feeder Platform
Max. 12 slots of 8mm Std. SMT tape feeder on
the feeder platform, compatible with
8mm/12mm/16mm/24mm Std. SMT tape feeder
FD-20 / FD-30 type Solder-preform Tape Feeder is optional

The corresponding specifications for solder-preform size is:
(FD-20) W 2mm~20mm, L 0mm~20mm / (FD-30) W 2mm~30mm, L 0mm~20mm

Size of Component (Die) 1mm x 1mm ~ 20mm x 20mm, Thickness: 0.06mm~5mm
Nozzle Changing Method Auto-Nozzle-Changer for 16 Nozzles
Jacking-Pin module 3 models selectable for chip size: 0.25~6 / 5~16 / 16~25
Eject-pin Set Changing Method By Manual (Auto Eject-pin Changer is optional)
Alcohol Spraying Optional alcohol spraying system with max. 3 nozzles at parallel
Transmission control of X/Y High precision linear motor driving system
Qty of Camera CCD Camera x 2 sets
FOV of bottom camera 20.7mm x 16.5mm (BT-CAM)
FOV of Fid-CAM
20.7mm x 16.5mm
(configuration of Fid-CAM & light source depends on the flange material)
Camera moving at Z-axis Fid-CAM adopted auto-focus function with Z-axis movement
Camera Calibration System with camera centering auto-calibration function
Fiducial Recognitions Auto-positioning of holder, carrier-frame and fiducial
Sequencing at Material PnP Matrix Form (four orientations selectable)
PCB Layout Conversion CAD Conversion
Operation System Windows 10
Pressure Air Requirement 80 psi (5.5 bar) @ 150 L/min
Power Supply Requirement 220VAC ±10%, 50~60Hz, 3.8kW
Dimensions (L x W x H) 1400mm x 2000mm x 1800mm (main unit without FFU)
Net Weight Approx. 2100 kg