MAS399 Pro Micro Assembly & Placement System

XY Placement Accuracy ± 10 ~ 20μm (process depending)
XY Resolution 0.001mm
R-Axis Resolution 0.02°
Feeding Forms Tape Feeder (std.) + Tray (optional) + Wafer (optional) system
Tape Feeder Platform For 8mm Tape Feeder x 32 slots (48 slots larger platform is option),
(compatible with Solder-plate tape feeder)
Wafer Platform (Optional) For 8" Wafer Die Flange,
the 4"/5"/6" flange platform is an option
Tray Platform (Optional) Max. 16 pcs of 2" Gel-Pak at each tray playofrm, max. 3 platforms installed
(if two or three tray platforms are installed, there is no space for wafer platform)
Productivity 1500/2000μph (1 or 2 Bonding Heads)
Pressure Control of Bond Head Torque control method, ranging from 30 ~ 500g (accuracy ±10g)
Glue Dispensing (Optional) Pressure valve + syringe, or Piezoelectric Jet System
Conveyor Through Left to Right
Conveyor System Multiple segments with independent driver
Board / Carrier Size Max. 600 x 300mm with Tray Platform installed
Max. 600 x 200mm with 8" Wafer Platform installed
Transmission Control High precision linear motor + non-touch linear encoder + linear rail
Component (DIE) Size 0.2 x 0.2 ~ 5 x 5mm
(special camera with bigger FOV is optional)
Types of Placement Objects Chips/DBC/Wafer/Solder-plate/Odd-form Shell and Odd-form components
Positioning Camera High Resolution Digital Camera
Object Positioning Method Pattern Matching / Pattern + Edge Matching (with BadMark identification)
Operating System Windows 10
Power Supply Requirement 220VAC ± 10%, 50~60Hx, 3.5kW
Dimensions 1783mm (L) x 1384mm (W) x 1620mm (H)
Weight Approx. 1300kg