Manncorp HPX1S Die Attach Machine

Produce high-quality semiconductor chips in
your manufacturing facility with our HPX1S Die Attach Machine. This die bonding machine is great for high-accuracy,
low-volume, die attach manufacturing needs.
Customization options are also available for unique applications.
It is equipped with 3 sets of CCD cameras and
a bottom camera to help with component alignment.
Easily and accurately handle die sizes from
1.4 x 1.4 mm to 7 x 7 mm.

HPX1S Die Attach Specifications
XY Repeatability ± 1.5μm
XY Placement Accuracy ± 25μm
R Rotation Accuracy ±0.3°
PCB Holding Vacuum with Sensor
Working Table Area max 9.84" x 9.84" (250 x 250 mm)
Wafer Frame Size 8" (Outer Dimension 296mm)
Component Size 1.4 x 1.4 mm – 7 x 7 mm
Camera System CCD x 3 Sets
Camera Resolution 1.3 M & 3 M
Component Alignment Digital Bottom Camera
Production Rate 1100 UPH
Storage 120GB SSD and 1TB HDD Back up
Air Requirement 80 psi (5.5bar) @ 150 Liter/min.
Grip Ring Handler For Wafer Ring
Ejector Pin Ejector
Power Requirement 200-230 VAC, 50-60Hz, 1.5kW
Dimensions (LxWxH) 35.8” x 59” x 71.6” (910 x 1500 x 1820 mm)