KLA-Tencor Surfscan 6220

Max Wafer: 200mm
System Dimensions: 30x40x66
Weight: 695 lbs
- Automatic Surface Inspection System
- Bare Wafer Surface Defect Inspection System
- Substrate/Sizes: 2", 3", 4", 6" and 8" Wafer Capable
- Thickness: SEMI Standard Wafer Thickness
- Material: Any Opaque, Polished Surface which Scatters less than 5 percent of Incident Light
- Defect Sensitivity: 0.09 Micrometer Diameter PSL Sphere Equivalent with greater than 80 percent Capture Rate (0.112um @ 90%)
- Repeatability: Count Repeatability Error less than 0.5 percent at 1 Standard Deviation (Mean Count greater than 500, 0.364 mm dia. Latex Spheres)
- Accuracy: Count Accuracy better than 99 percent (verified with VLSI Standards’ Relative Standard)
- Throughput: 100 wph (200 mm) at 0.12 mm
- Contamination: Less than 0.005 Particles/cm2 greater than 0.15 mm dia. per single pass
- Cassette Handling: Single Puck Wafer Handling from two Cassettes (one Sender/Receiver, one Receiver)
- Illumination Source: 30 mW Argon-Ion laser, 488 nm Wavelength