Used Semiconductor and PCB Manufacturing
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Stepper Model 1600 Year(s) : 2001 Location : EUROPE (Western and Northern)
Price : On request
More detailsPrecision dicing saw SEM and TEM Location : EUROPE (Western and Northern)
Price : On request
More detailsNOVELLUS, INOVA NEXT, 300mm Tool ID: MDX2951 Year(s) : 2013 Location : EUROPE (Western and Northern)
Price : On request
More detailsTCDEV-26 TEL ACT 8 COATER/DEVELOPER (ex CTDV-A19) Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsSqueegee: Up and down drive by air cylinder, printing pattern (single/double) Printing pressure adjustment: Pr Year(s) : 2016 Location : ASIA (North East)
Price : On request
More details[Main specifications] - Processing method: Batch method - UV lamp wavelength: 185nm, 254nm - Replacement lamp: Year(s) : 2018 Location : ASIA (North East)
Price : On request
More details[Light probe measurement] - Measurable range (XY): 90 x 90 mm - Maximum measurement depth: 30 mm - Light probe Location : ASIA (North East)
Price : On request
More detailsModel RM01 Location : EUROPE (Western and Northern)
Price : On request
More detailsTCDEV-30 TEL ACT 8 COATER/DEVELOPER(former CTDV-A17) TEL ACT8, 200mm Year(s) : 1999 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsTRACK TEL ACT8 200mm Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bondin Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsThin film measurement tool Broadband UV optics Dual beam spectrophotometry Wafer sizes: 100mm, 150mm, and 200m Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsManual wafer load substrate bonder Set up for fusion compression bonding, thermal compression bonding, and an Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsThe Oxford Plasmalab 100 is a modular plasma processing system. It can be configured to carry out Reactive I Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsWafer sorter for 300mm wafer Version: 300mm De-installed, warehoused. Can be inspected by appointment. 2 port Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMask Aligner with CIC1000 lamp housing Version: 200 mm The machine was in working condition up until it was Year(s) : 2019 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsFEATURES - HYBOND Soft TouchTM energy system. - Front panel ultrasonic test button. - Deep vertical access of Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details552 is a wedge bonder with thermocompression Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details572 is a Vertical Feed Ultrasonic Wedge/ Wire Bonder Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsModel 365 Capabilities: Cures most UV tape in 5 seconds Large exposure area cures up to 300mm wafers. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details7372E Convertible Epoxy/Eutectic Die Bonder. Unlimited deep reach access to remote bond targets on large packa Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details50WS welder has a 50 WATT second capacitive discharge. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsPolisher Grinder with Vector LC Power Head. Buehler Metaserv 3000 single plate automatic polishing machine wit Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailswelder has a heavy duty weld head Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsHTT-550 welder has a solder reflow system. Includes VTA66 head and TEM calibrator. Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14