Used Semiconductor and PCB Manufacturing
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Screen Printer(R>L/Center) Year(s) : 2005 Location : ASIA (North East)
Price : On request
More detailsReflow furnace/R>L Front Model SAI-838 Year(s) : 2005 Location : ASIA (North East)
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More detailsReflow oven Location : ASIA (North East)
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More detailsother: Wafer marker/5in Location : ASIA (North East)
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More detailsReflow Oven Model SX-1508N2 Year(s) : 2003 Location : ASIA (North East)
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More detailsReflow oven Model tnp25-538em Year(s) : 2010 Location : ASIA (North East)
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More detailsReflow oven(L＞R) Model TNP25-537PM Location : ASIA (North East)
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More detailsSCR:Printing Machine/(L＞R) Model MK-888SV Location : ASIA (North East)
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More detailsScreen Printer Year(s) : 2014 Location : ASIA (North East)
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More detailsSCR:Solder printing machine Year(s) : 2001 Location : ASIA (North East)
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More detailsScreen Printer(M size): R>L/Front Year(s) : 2006 Location : ASIA (North East)
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More detailsScreen Printer Year(s) : 2008 Location : ASIA (North East)
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More detailsPri: Solder Paste Inspection/3D Location : ASIA (North East)
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More detailsReflow Oven(AIR) Year(s) : 2005 Location : ASIA (North East)
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More detailsReflow Oven Year(s) : 2003 Location : ASIA (North East)
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More detailsReflow Oven Location : ASIA (North East)
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More detailsele: INTEGRATED HiTESTER Location : ASIA (North East)
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More detailsCoater: Spin/SOG Year(s) : 1993 Location : ASIA (North East)
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More detailsassy: Temperature Test Chamber Year(s) : 2004 Location : ASIA (North East)
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More detailsWire saw 200mm/300mm Year(s) : 2000 Location : ASIA (North East)
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More detailsChip mounter Year(s) : 2004 Location : ASIA (North East)
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More details3D Solder paste inspection Year(s) : 2013 Location : ASIA (North East)
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More detailsSolder Paste Inspection/3D Location : ASIA (North East)
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More detailsDispenser Year(s) : 2013 Location : ASIA (North East)
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More detailsDispensing Robot Year(s) : 2005, 2007 Location : ASIA (North East)
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More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14