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Used Semiconductor and PCB Manufacturing

8,947 results
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Condition Fair Weight 220 lb (100 kg) Exterior Dimensions Width 17.717 in (45.0 cm) Depth 21.654 Year(s) : 1997 Location : EUROPE (Western and Northern)

Price : On request

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Conveyor ASYS BC0 02 Condition Excellent Year(s) : 2016 Location : EUROPE (Western and Northern)

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This furnace can handle wafers up to 150mm Configuration: N2 - 1500 l/min N2 - 660 l/min Forming Gas 660l Year(s) : 1994 Location : EUROPE (Western and Northern)

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SP40-Burn In Oven System (4th set) Accessories Controller Board and Burn-In Board for SP40 included. Burn-I Year(s) : 2017 Location : EUROPE (Western and Northern)

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Manufacturer TEXUS CO., LTD. Condition Good Exterior Dimensions Width 86.614 in (220.0 cm) Depth 4 Year(s) : 2015 Location : EUROPE (Western and Northern)

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SP40-Burn In Oven System (5th set) Condition Good Exterior Dimensions Width 79.134 in (201.0 cm) Dep Year(s) : 2018 Location : EUROPE (Western and Northern)

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Condition Good Exterior Dimensions Width 86.614 in (220.0 cm) Depth 49.213 in (125.0 cm) Height Year(s) : 2016 Location : EUROPE (Western and Northern)

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Description Stencil Printing Power Requirements Other V 4.9 A 1.6 A(2) 50/60 Hz 3 Phase CE M Year(s) : 2017 Location : EUROPE (Western and Northern)

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Accessories No Other Information Wafer size range: 6/8 inch Manuals existing Directly available Condition Year(s) : 1999 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 39.370 in (100.0 cm) Depth 98.425 in (250.0 cm) Height 62.992 in (1 Year(s) : 2014 Location : EUROPE (Western and Northern)

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CE Marked YES Condition Good Capable of processing up to 6" wafers, delivery of additional accessories is po Year(s) : 2008 Location : EUROPE (Western and Northern)

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Condition Excellent CE Marked YES Year(s) : 2010 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 36.220 in (92.0 cm) Depth 33.071 in (84.0 cm) Height 78.740 in (200 Location : EUROPE (Western and Northern)

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Dispenser Condition Like New Power Requirements 220/240 V 50/60 Hz Exterior Dimensions Width 562.99 Year(s) : 2014 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 74.803 in (190 Year(s) : 2005 Location : EUROPE (Western and Northern)

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Laboratory ovens, fresh-air with explosion protect Location : EUROPE (Western and Northern)

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eS32 e-beam wafer inspection 200mm Condition Fair Serial Number(s) 2032 Year(s) : 2006 Location : EUROPE (Western and Northern)

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Description Lab Handler Condition Good Exterior Dimensions Width 78.740 in (200.0 cm) Depth 35.433 Year(s) : 2012 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 74.803 in (190 Year(s) : 2010 Location : EUROPE (Western and Northern)

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Condition Good Exterior Dimensions Width 86.614 in (220.0 cm) Depth 49.213 in (125.0 cm) Height Year(s) : 2011 Location : EUROPE (Western and Northern)

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User Manual available Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 86.614 in (220.0 cm) Depth 49.213 in (125.0 cm) Height 90.984 in (2 Year(s) : 2011 Location : EUROPE (Western and Northern)

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Wafer Size Range Minimum 100 mm Maximum 150 mm Condition Good Serial Number(s) Inline-Sprühätzanlage Year(s) : 2009 Location : EUROPE (Western and Northern)

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Exterior Dimensions Width 47.244 in (120.0 cm) Depth 58.268 in (148.0 cm) Height 66.929 in (1 Year(s) : 2015 Location : EUROPE (Western and Northern)

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There are failing resources (on higher pins). Standard mixed signal tester 200MHz/256 channels Condition Good Year(s) : 2000 Location : EUROPE (Western and Northern)

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Used Semiconductor and PCB Manufacturing for sale

You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).

Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.

Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.

This industry is largely located in Asia and expecially in China.

The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES) 

The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14

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