Used Semiconductor and PCB Manufacturing
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In good condition. Exterior Dimensions Width 70.866 in (180.0 cm) Depth 70.866 in (180.0 cm) Height 78 Year(s) : 2011 Location : EUROPE (Western and Northern)
Price : On request
More detailsAutomated Wafer, Die and Bump Inspection System Version: 300 mm Vintage: 01.06.2008 Dimensions on base: 72 in Year(s) : 2008 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsAutomated Macro Defect Inspection Version: 150 mm/200 mm Automatic Shut down in Fab. Needs to be removed in t Location : AMERICA North (USA-Canada-Mexico)
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More detailsREFLOW OVEN Version: SMT Vintage: 01.06.2015 Automatic Shut down in Fab. Needs to be removed in the next few Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsMultilayer presses Model Bonding Pinless 211 Location : EUROPE (Western and Northern)
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More detailsModel XpertJet 461 UF Location : EUROPE (Western and Northern)
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More detailsID 16″ W X 12″H X 11″ DEEP 2″ DIAMETER PORT TO PASS WIRES THROUGH -70 TO 200 DEG C REFRIDERATED, NO LN2 REQUIR Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More details10 cubic ft / with a VersaTenn III controller (programmable) ID 24 X 27 3/4 H X 26.5″ Deep, -70 TO 200 DEG C C Location : AMERICA North (USA-Canada-Mexico)
Price : On request
More detailsBLUE M CR07-146 hepafilter oven, id 10wx14x14″, 250 deg c, 208v Location : AMERICA North (USA-Canada-Mexico)
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More detailsMPN:2100-700 complete with all manuals Location : EUROPE (Western and Northern)
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More detailsElectro-migration Oven Year(s) : 1998 Location : EUROPE (Western and Northern)
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More detailsWAFER SIZE 12 Location : EUROPE (Western and Northern)
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More detailsType: Reflow oven Year: 2014 Machine specifications: Air-only 8 Heating zones: 264cm/104" 2 Cooling zones: 66 Year(s) : 2014 Location : AMERICA North (USA-Canada-Mexico)
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More details[Specifications] Observation window: Yes Temperature range: -20 to +170°C Shelf: 2 Cable hole: φ50mm x 1 locat Year(s) : 1999 Location : ASIA (North East)
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More details[Specifications] - Compatible board size: 40 x 40 mm to 460 x 370 mm (2 kg or less) - Device size: 10 to 50 mm Year(s) : 2007 Location : ASIA (North East)
Price : On request
More details【specification】 Model year 2010 Observation window available Temperature range -40~+100℃ 2 shelves Humidity Year(s) : 2010 Location : ASIA (North East)
Price : On request
More details【Main Specifications】 ・Controller: IM-6700 ・Measuring head: IM-6225 (wide field of view/variable illumination Location : ASIA (North East)
Price : On request
More details【specification】 Model: Type: MD-X1020 (wide area specification) Type: XYZ3-axis simultaneous scanning method M Year(s) : 2017 Location : ASIA (North East)
Price : On request
More details【specification】 Printing laser: Fiber laser class 4 laser Laser wavelength: 1064nm Laser oscillator output: 20 Year(s) : 2019 Location : ASIA (North East)
Price : On request
More details【specification】 Printing method: XYZ3-axis simultaneous scanning method Printing laser: YVO4 laser Wavelength: Location : ASIA (North East)
Price : On request
More details【specification】 ・Measurement part: XM-T1000 (2 probe type) ・Controller: XM-1500 ・Measurement range: 300mm x 25 Location : ASIA (North East)
Price : On request
More details【specification】 ・Controller: IM-6700 ・Measuring head: IM-6225 (wide field of view/variable illumination type) Location : ASIA (North East)
Price : On request
More detailsOne Shot 3D Shape Measuring Machine 【specification】 ・Year: 2015 ・Measurable height: Wide field mode 10mm, h Year(s) : 2015 Location : ASIA (North East)
Price : On request
More detailsUltra-low temperature incubator 【specification】 Year: 2012 Observation window available Temperature range - Year(s) : 2012 Location : ASIA (North East)
Price : On request
More details【specification】 Model year 2018 Method: Front blowing type horizontal laminar flow circulation ventilation sy Year(s) : 2018 Location : ASIA (North East)
Price : On request
More detailsUsed Semiconductor and PCB Manufacturing for sale
You will find machines for the manufacturing of the electronic chips and their assembly on printed circuit boards (PCB).
Semiconductors market have exceeded 500 billion usd in 2019. It covers memory devices, logic devices, analog IC, MPU, power devices, MCU, sensors, that will be used in an increasing number of applications such as computers, mobile phones, all electronic appliances, electronic in aotomotive industry, machinery and many more.
Once the semiconductors are manufactured they are assembled on the PCBs and main machines needed for this purpose are pick and place machines, sodering owen, secreen printing machines for solder paste, dispensers for glues.
This industry is largely located in Asia and expecially in China.
The main manufacturers machine are Mydata, Universal, Juki, Panasonic, Fuji, Samsung, Manncorp, Siemens, ASM, Quad, Assembleon, Universal Instruments, Europlacer, Philips, Advantest, AG Associates, Agilent, AMAT, Anritsu, Applied Materials, Aqueous Technologies, ASM, Asymtek, ASYSBausch & Lomb, Blue M, Branson, Branson / IPC, BTU, Camalot, Canon, CTI,Dage, DEK, Despatch, Disco, DNS, DynaPace, Ebara, Edwards, Ekra, Electro Design, Electroglas, Electrovert, Ersa, Esec, EVG, Gasonics, Heller, Hewlett Packard (HP), Hitachi, Jot, K & S, Kanetic, Karl Suss, Keithley, Keysight, KLA-Tencor, LAM, Leica, Leybold, Lynx, Mania, Matheson, Mirtec, MPM, Nanometrics, Nikon, NuTek, Olympus, Oxford, Plasmatherm, Rohde & Schwarz, Rudolph, Schmid, Seho, Semitool, Simplimatic, SMT, Speedline, Suss, Technics, Tegal, Tektronix, TEL, Tencor, Tenney, Teradyne, Thermotron, Tokyo Semitsu Kogaku (TSK), Varian, Veeco, Venntek, Verteq, Vitronics, Vitronics Soltec, VWR, West Bond, YESTech, Yield Engineering Systems (YES)
The main model my12, TX2i SIPLACE, Mydata My200SX-14, KE-2050L, MY9, GSM2 4681A, Topax XII, CP40V, 730L, TX2i, SL940E, XP243E, 4982, MY15, MC389CY-F3-V, Siplace CA4, YG100-RB, MY100SXe-14