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Used Bonder

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The Westbond 4600 is a deep access wedge ultrasonic wire bonder, as is, no generator. Location : AMERICA North (USA-Canada-Mexico)

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STEREO ZOOM OPTICS WIRE FEED APPEARS TO BE 45 DEGREES DEEP ACCESS CLAMPS INCLUDES SMALL KEYPAD ALSO INCLUDES I Location : AMERICA North (USA-Canada-Mexico)

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Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns) by the popular thermocompression te Location : AMERICA North (USA-Canada-Mexico)

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The Westbond 7443A is a dual channel ultrasonic tacker Location : AMERICA North (USA-Canada-Mexico)

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20 HEAVY WIRE BONDER FOR 10-20 MIL WIRE INCLUDES CALIBRATED STEREO ZOOM OPTICS (ADD $740 FOR DEEP ACCESS CLAMP Location : AMERICA North (USA-Canada-Mexico)

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7400B Wedge bonder for deep access Location : AMERICA North (USA-Canada-Mexico)

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Die Shear Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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WESTBOND ULTRASONIC WIRE BONDER (60 degree feed) Ultrasonically bonds fine wires in the range of .7 mil (18 mi Location : AMERICA North (USA-Canada-Mexico)

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S1160 PROBE STATION 6″ WAFER CHUCK WITH 6X6″ TRAVEL B&L MICROZOOM OPTICS, ZOOMS FROM 80-160X AND 250-500X Location : AMERICA North (USA-Canada-Mexico)

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The Electroglas 1034X prober has a 4″ chuck an automatic prober and lined platen movement. Location : AMERICA North (USA-Canada-Mexico)

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Die Shear Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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ST 80 is a die shear Digital readout with 80 transducer. Location : AMERICA North (USA-Canada-Mexico)

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AUTOMOVE 402 TABLE TOP DISPENSING UNIT Location : AMERICA North (USA-Canada-Mexico)

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Manual Z-lever control for die placement Direct view of die placement, providing the highest level of accuracy Location : AMERICA North (USA-Canada-Mexico)

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FEATURES Manual “Z” lever control of both tool and dispenser automatically compensates for multi-level bondin Location : AMERICA North (USA-Canada-Mexico)

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(CASSETTE LOAD) INCLUDES 6″ CHUCK, JOYSTICK, MONITOR/KEYBOARD (LAST PM WAS IN EARLY 2019 BY MARTEK, VERY GOOD Location : AMERICA North (USA-Canada-Mexico)

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Wire Pull Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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Wire Pull Bond Tester Location : AMERICA North (USA-Canada-Mexico)

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BT 30 is a die shear tester destruct/non destruct with a built in printer. Location : AMERICA North (USA-Canada-Mexico)

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The Mechel 202 bonder is a pull tester. Location : AMERICA North (USA-Canada-Mexico)

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epoxy die bonder Location : AMERICA North (USA-Canada-Mexico)

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WAFER BONDER, BONDS RUBBER DISC TO WAFERS UP TO 6″ PRIOR TO DICING, SCRIBING Location : AMERICA North (USA-Canada-Mexico)

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GOLD TIN REFLOW SYSTEM Location : AMERICA North (USA-Canada-Mexico)

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Deep access vertical feed wedge bonder (bonds gold wire, gold ribbon or aluminum wire)20220610 152426 Includes Location : AMERICA North (USA-Canada-Mexico)

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VERTICAL FEED WEDGE BONDER TRUE VERTICAL MOVEMENT DEEP ACCESSG20220214 143050 copy EXTENDED TRANSDUCER LARGE X Location : AMERICA North (USA-Canada-Mexico)

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You can find used Bonder on Wotol

The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi , Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S) , Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron , Unitek .

The main model 2008HS3 Plus, Eagle Express GOCu , DieSeries, 2100 hS, T-3000-FC3 , Delvotec 5610, Royce 550 Die Bonder, 1204W, A7372E, 7374B, 4523, 1204W, 827, 907Series, 1204B, 829Z, 909Series, 20 Wedge, AD896-06, 2200 EVO, Eagle 60, 2200 APM, 5400B, 7400, 7416, 3100, DINP, 3100, Delvotec, Wedge, LAW-820, DBD3550R, UTC1000, M360C, 850TB,7200A, 520, BT,  572-40, DXB,  505Series, SA220, 4000, 572A, 522, 552A 3000, 703, 709/703, 1WBT5, 850Series, 8000, 3088, 2006S, 3018, 4000HS, CP-222, Swissline, 4020Series, 4450, 7200c, 703/709, 454630E-79, 7400B HBSeries OE, 4000, 360C, 20, 6320, 1WBS2, 990, 20R, 2400PC, 7400A, AD809S Series-4000-P, BJ920 M360C, 8000, UH130, 2200, 2100XP, Leadfrme, 3200, 2100FC, 2008, HS3PLUS, 3088CU, AB339, AD898, 898, 2470-V.

HS Code 8486 90 00 for Die Bonder Machine - Parts and Accessories and other machinery from 8486 Machines and apparatus of a kind used solely or principally for the manufacture of semiconductor boules or wafers, semiconductor devices, electronic integrated circuits or flat panel displays

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