Westbond 7200A Wire Bonder

Epoxy dispense and chip pickup tool are
grouped into one tool assembly which is
motor and cam driven to oscillate into use
position. Machine senses either epoxy
dispense or chip pickup through relative
position of the patented single-lever X-Y-Z
manipulator.

Inert Atmosphere for heated workholders: Preforms, packages subject to oxidation.
Hexacollet Turret (unheated): Preforms, hybrids, pick and place.
Large X-Y Platform, with ball race: Small devices requiring less than 1″ x 1″ gross motion.
Free Furnace with Die Presentation,
complete with Temperature Controller: Preforms and devices requiring heat.

2″x 2″ Fluoroware Support (Wafflepack): Alternate to random die presentation.