N&K Technology OptiPrime - CD
ASIA (North East)
Wafer Size 8"
Tool's Condition Refurbishing
•; Optimized Polarized Reflectance (Rs and Rp) Data
- Wavelength Range: 190 - 1000 nm
- Micro-Spot Technology
•; Can be Configured for 300 mm (12”), 200 mm (8”),and 150 mm (6”) Wafers
•; Fully Automated
•; Based on Patented Reflective Optics that Optimizes the Signal-to-Noise Ratio
•; Strong Sensitivity to Sub-Nanometer Structural and Material Variations
- Thickness, n and k (from 190 –; 1000 nm)
•; OCD Metrology for 2-D and 3 -D Structures
(Trenches and Contact Holes)
- Depth, CD, Profile
•; Cognex Pattern Recognition Software
•; No Re-Alignment Issues Upon Light Bulb Replacement
•; Modular design –; Easy to Maintain and Service
•; GEM/SECS Communication Interface
•; SEMI Standard and Third Party Certifications
.Dimensions (W x D x H): 112 cm x 202 cm x 189 츠
.Weight (unpacked): 770 Kg
.Facility Requirements:
100 - 240 V, 50/60 Hz, 1Φ
Vacuum, CDA (for FOUP Load Port)