N&K Technology Little foot 8000 CD

N&K 8000 Trench Depth & Thin film thickness Measurement

Wafer Size 8"
Vintage 2007
Fully Automated Thin Film Metrology System for Patterned and Unpatterned Wafers

DUV - Vis - NIR: 190nm to 1000nm
Reflectance, Polarized
Analyzer Unit with spot size : 50 um
Cognex Pattern Recognition Software
Windows 7 Operating System
S/W Version : 10.5.3.0
n&k's Thin Film Characterization S/W
n&k's Standard Films Library
Automated Wafer Loading/Unloading
Assyst Loadport for 8" Wafers
Computerized X-Y stage for full wafer mapping,and wafer alignment capability
Z-stage to acccommodate multiple substrate thickness
SEMI and CE Certification
Application :
Simultaneously determines thickness, n and k of thin films including semiconductors,dielectronics (SiO2, Si3N4),etc, Polymers (Photoresist,etc),and very thin metals

- Thin Film : Film Thickness / n and k
- OCD : Depth / CD / Profile