N&K Technology 3000
ASIA (North East)
N&K 3000 Trench Depth & Thin film thickness Measurement
Wafer Size 6"
Non-destructive measurements of Trench Depth
Thickness, Refractive Index(n,RI) Extinction Coefficient (k), Energy Bandgap measurements of thin film
and also measure reflectance, transmittance, and interface roughness for a wide variety of thin films and substrates
- Wafer size up to 6" ( available 8" by conversion)
- Fully automatic wafer handling
- Wavelength range DUV-VIS-NIR : 190 to 1000 nm
- 50 um spot size
- Measurement thin films : OXIDE/PR/NITRIDE/OXINITRIDE/POLY/Ti/TiN…
- Measurement items : Trench Depth, thickness, n(RI), K, Reflectance, Transmittance,..
- 2D/3D Map