MEI 772 Bonder
Ref :
2624839-9-CP
Condition :
Used
Manufacturer :
MEI
Model :
772
Short Description :
Bonder
Year(s) :
-
Quantity :
1
Location :
Seller or machines location:
AMERICA North (USA-Canada-Mexico)
AMERICA North (USA-Canada-Mexico)
FEATURES
Manual “Z” lever control of both tool and dispenser automatically
compensates for multi-level
bonding.
Positive viewing of dispensed dots permits various amounts of
material to be dispensed for different size chips.
Positive mechanical dispensing system produces consistent dots from .005″ to. 100″
Other machines similar to MEI 772 Bonder
1
MEI 909 Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
Mech-El MEI Marpet 1204B Manual Gold Ball Bond Wire Bonder
Location :
EUROPE (Western and Northern)
1
MEI 1204B Bonder
Location :
AMERICA North (USA-Canada-Mexico)
1
MEI 829Z Wire Bonder
Location :
AMERICA North (USA-Canada-Mexico)