KLA-Tencor OSA6100

[ General Description ]
Wafer Size : 2 ~ 6 inch
Illumination Source : 25 mW laser, 405 nm wavelength
Operator Interface : Trackball and keyboard standard
Substrate Thickness : 350 μm ~ 1,100 μm
Substrate Material : Any clear or opaque polished surface

[ Performance ]
Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si)
Other Defects and Applications : Particles, scratches, stains, pits, and bumps.
Sensitivity: Minimum detectable size for automatic defect classification:
- Scratches: 100 μm long, 0.1 μm wide, 50 Å;; deep.
- Pits: 20 μm diameter, 50 Å;; deep
- Stains: 20 μm diameter, 10 Å;; thick

[ Application ]
- Disk substrates