KLA-Tencor OSA6100

[ General Description ] Wafer Size : 2 ~ 6 inch Illumination Source : 25 mW laser, 405 nm wavelength Operator Interface : Trackball and keyboard standard Substrate Thickness : 350 μm ~ 1,100 μm Substrate Material : Any clear or opaque polished surface [ Performance ] Defect Sensitivity 0.08 μm diameter PSL sphere equivalent > 95% capture rate(PSL on bare Si) Other Defects and Applications : Particles, scratches, stains, pits, and bumps. Sensitivity: Minimum detectable size for automatic defect classification: - Scratches: 100 μm long, 0.1 μm wide, 50 Å;;; deep. - Pits: 20 μm diameter, 50 Å;;; deep - Stains: 20 μm diameter, 10 Å;;; thick [ Application ] - Disk substrates