KLA-Tencor Candela 8620

- Cassette Handling
- Laser: Circumferential(50mW, 405nm), Radial(85mW, 660nm)
- Spot size: 5㎛ x 4㎛.
- Handler: Mapping,Wafer centering on chuck and FFM: OK, Wafer loading/unloading: OK
- Particle detection: smaller than 0.08㎛ on silicon substrate.
- Scratch: 0.1㎛ wide, 1~2nm deep.
- Pits and Bumps: 20㎛ diameter, 50Å; deep.
- Stains: 20㎛ diameter, 10Å; thick.
- can be used for both epi and bare substrate.
- can be used for Si, GaAs, Al2O3,SiC substrate.
- Substrage thickness: 350㎛ ~ 1,300㎛.
- Air Balance system ULPA and HEPA air filter(replaced new one).
- Input Power 115V 12A 50/60Hz
- Input Air: CDA 90 PSI