KLA, MicroSense UMA-C200-STR

KLA / MicroSense UMA-C200-STR Thin Film Stress Measurement
System consisting of:
- Vintage: Approximately 2019
- Provides:
- Wafer Thickness
- Average wafer bow and warp, average wafer radius of
curvature
- Average wafer film stress
- 2D Local Stress Map with Min and Max values
- 3D Local Stress Map with Min and Max values
- Local Line Stress Profiles with specified orientation,
including Min and Max values.
- Exportable data and maps
- Used Minimally for R&D & Light Production