KLA 2132 Wafer Inspection System

The system was deinstalled in september 2002 and
until that date was upgraded with various hardware and
software upgrades.
Facilities: 120v 3 phase 25A per phase
KLA2132 Board Configuration
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MAIN CARD CAGE
DP 710-683424-001 REV AA
DF 710-661726-00 BD1
API 710-658036-00 REV C1
API 710-658041-20 REV E0
UP 710-658046-00 REV F0
XINT 710-658176-00 REV A0
YINT 710-658172-00 REV H0
XINT 710-658176-00 REV A0
YINT 710-658172-00 REV H0
CT 710-655651-20 REV C0
CT 710-655651-20 REV C0
MM 710-659412-00 REV C0
MM 710-659412-00 REV C0
MC 710-658232-20 REV H0
IF1 710-658086-20 REV E0

AUXILIARY CARD CAGE
*******************
DF 710-678525-001 REV AB
DD 710-650044-20 REV DB0
DP 710-678545-00 REV B1
RTF 710-652840-20 REV D3
710-659485-20 REV??

General Description
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The KLA 2132 is capable of inspecting at the following rates:
Sensitivity: 0.62 ------- Speed: 5 sec/cm2
Sensitivity: 0.39 ------- Speed: 15 sec/cm2
Sensitivity: 0.25 ------- Speed: 30 sec/cm2
and includes the following:-
wafer inspection module for 4, 5, 6 or 8 inch wafer size
SUBSTRATES: For silicon wafers conforming to SEMI standard M1.1
Wafer diameter (mm): 100 100 125 150 200
Wafer thickness (?m): 525 625 625 675 725
SENSITIVITY AND INSPECTION SPEED:
Die to Die Mode
Sensitivity (um) Speed (sec/cm2)
0.60 05
0.50 1.5
0.40 15

Cell to Cell Mode
Sensitivity (um) Speed (sec/cm2)
0.30 05
0.25 30
0.20 15
Full performance specifications are available on request