F&K Delvotec 5432 Bonder

Bond Head:
90 Degree Wire Feed
Electronic Touchdown Sensing for every bond
Programmable Output Ultrasonic System, 0 to 5 Watt 100 KHz
Programmable Bond Force 15 to 150 cN

Working Area:
Y Axis, 50mm Z Axis, 50mm 2.5 Micron Resolution
Standard Work Height 136mm (Mid Z Stroke)
X/Y Manipulator from 5 x 5 mm to 18 x 18
mm
Equivalent Manipulator Step-Down 1:2 to 1:7

Operating Modes: Semi-Automatic, Automatic, Multi-Wire Step Mode For Program Debug
Loops: Standard Rectangular, Standard Triangular, Single Reverse, Double Reverse Stitch; Table Tear
Program Storage: Up to 50 Individual Wires Per Program, 250 Programs Per 3.5" Floppy Disk
Power Requirements 115/ 230 V 50/60 Hz 1 Phase
Exterior Dimensions
Width 26.000 in (66.0 cm)
Depth 29.000 in (73.7 cm)
Height 17.000 in (43.2 cm)