Esec 8003

Specification:

Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")
Thickness of substratum disc (wafer): 0,01–5,0 mm
Minimal width of cut: 250 μm pre Si wafer
Minimal size of the chip: 1x1 mm
Axle X (shift): 240 mm
Axle Y (index): 165 mm
Index of the step: 0,02–100 mm
Axle Z (vertical): 10 mm
Angular displacement: 0,01–165 stupňov
Spindle speed: 15,000–50,000 rpm
Air pressure: 4,4 - 5,8 bar (64-85 psi)
Water pressure: do 5,8 bar (85 psi)