Yield Engineering Systems (YES)

YIELD ENINEERING INC., YES 53RE, Plasma Cleaning System

3 Mass Flow Controllers (MFCs) for gas mixing
Clean Room Capability: Class 10
N2 Flow Rate: 1.7 SCFM
Process Gas Flow Rate: 20-50 SCCM average
Chamber Material: 6061-T6 aluminum
Process Gas Inputs: 3 standard, Ar, O2, N2, 4th optional
SEMI® S2 Compliance
Number of Recipes: 12 with load/save/loop/link capability
RF Plasma Power: 0-500 watts @ 550 VAC, selectable power
Nitrogen Consumption: 0 SCFM idle, 1.7 SCF for average processes
Reactant Gas Consumption: 0 SCFM idle, 150 SCC for average processes