Seho GoSelective 1-IN

Description:

System for selective miniwave soldering, dip soldering or conventional wave soldering processes.
Up to two soldering units can be integrated in one machine.
Maximum assembly dimensions of 500 x 500 mm (19.68″ x 19.68″).
High precision double portal axis.
Maximum flexibility.
Solder waves with touchless wave height control for highest reliability.
Modular construction allows the system to grow, to reduce cycle times.
Gripper rotation up to 270° and tilt function up to 12°.
Easy to handle teaching function, online or offline.
Maximum machine availability.
Minimum maintenance requirements and ideal accessibility.
inline system.