MPM Speedline Momentum BTB

DOM : 11/2016

Notable features :
Edgeloc side clamping : The EdgeLoc system uses a
side snugging technique that removes the need for
top clamps which interfere with the PCB to stencil contact.
The result is optimal gasketing and
more volumetrically consistent edge-to-edge prints.
With EdgeLoc II, robust flippers engage to
secure the board across the top edge ensuring board flatness
then move out of the way once the board is firmly gripped from
the side. EdgeLoc+ board clamping can change between edge
and top clamping simply through software.

Paste roll height monitor : The Paste Height Monitor is
designed to prevent defects caused y inadequate volumes of
paste on the stencil. It combines advanced software and
sensor technology to accurately monitor the paste bead for
volume consistency. Upper and lower limit roll-height
monitoring eliminates insufficient or excess paste volumes.
It is a non-contact solution that can automatically add
more paste to the stencil as it is needed.
Solder Paste Dispenser
Closed loop squeegee pressure
Windows 7 O/S