Manncorp MC301

Design Ideal for Labs and Small-Scale Production
Measuring only 29.2" L x 23.75" W x 12.5"
H (742 mm L x 603 mm W x 318 mm H) and
weighing under 150 pounds, the MC301 easily installs on
virtually any benchtop. Its ability to
simulate inline reflow profiles with
preheat, soak, reflow, and cooling phases makes it
a great choice for labs or other installations where
space is often at a premium.
The front-loading heating chamber has
an effective soldering area of 9.84" x 7.87"
(250 mm x 200 mm) and includes a window for
viewing of the soldering process.

Easy Installation - Up and Running in No Time
The MC301 has an average power rating of
3.6 KW (6.3 KW, peak) and requires a 220-240V,
single-phase, voltage supply rated at 30 amps.
Built-in circulation fans provide air flow for
heating and cooling, and hot air is exhausted through a
2.5" flanged outlet on the rear of the unit.
For removal of flux fumes, it is recommended to
hook up a non active flexible hose or a vent hood.

Exclusive Android-Based Control Application
The MC301 Android-based control app provides an
easy-to-use, touch-panel interface with
virtual keyboard for setting the temperature and
duration of the preheat, soak, reflow, and cooling stages.
In the reflow zone, the user can specify the dwell at
both the melting and peak temperatures.
Based on these settings, the system will
also automatically calculate the heating or
cooling rate in each stage for verification with
solder paste and component manufacturers' specifications.
In addition, when heater control is based on
the higher temperature measured at the heaters,
the system displays the calculated board temperature based on
a calibrated offset.

Real-Time Temp Control via On-Board TC
In the MC301's password-protected advanced settings,
the unit can be switched into a separate control mode that
uses real-time feedback from a built-in, flying thermocouple.
In this mode, with the thermocouple attached at
a strategic location on the PCB surface,
heater control is based on the actual temperature measured at
the thermocouple. As you can see in this screen capture,
the target temperature is equal to
the thermocouple temperature and there is no offset.

Temp Recordings Easily Saved & Distributed via WiFi
In the run mode, the high-resolution touch-panel displays a
graphical representation of the heat zone temperature (red)
versus the PCB temperature (yellow) throughout the
reflow cycle. For process control and traceability,
screens can be saved as separate files and
distributed electronically via Email or
across networks using the Android OS and
built-in WiFi capability.

Specifications
Applicable Solder Types Lead-Free or SnPb
Heating Method IR & Forced Hot Air Convection
User Interface Android Software Platform
Ultra High Resolution Touchscreen
Integrated WiFi & Networking
Effective Soldering Area 9.84" x 7.87" (250 mm x 200 mm)
Temperature Range Ambient - 310 °C
Temperature Precision ±2 °C
Temperature Control Method PID Control; SSR Contactless Switch Circuit
Warm-Up Time Approx. 2.5 min.
Power 3.6 KW (avg.); 6.3 KW (max.)
Voltage 220 V, Single Phase, 50/60 Hz
Exhaust Temperature (approx.) 60 °C
Dimensions 29.2" L x 23.75" W x 12.5" H
(742 mm L x 603 mm W x 318 mm H)
Weight Approx. 148 lbs. (67 kg)