Manncorp Auto-Dip 6035-TS Dip Soldering System

Model: Auto-Dip 6035-TS Dip Soldering System

Used
Details:
Auto-Dip 6035-TS Soldering System - Specifications
PCB Size: Finger-Type PCB Holder:
600 mm x 350 mm (23.6" x 13.8") max.
50 mm x 50 mm (1.9" x 1.9") min.
Pin-Type PCB Holder:
600 mm x 350 mm (23.6" x 13.8") max.
60 mm x 60 mm (2.4" x 2.4") min.
Solder Pot Size: 650 mm W x 400 mm D x 70 mm H
(25.6" x 15.75" x 2.75")
Solder Pot Capacity: approx. 100 Kg (220 lbs.) Lead-Free SAC
approx. 120 Kg (265 lbs.) SnPb
Solder Pot Temperature: recommended 285 °C (545 °F) Lead-Free SAC
recommended 265 °C (509 °F) SnPb
450 °C (842 °F) max.
Solder Dwell Time: 1-10 sec.
Preheat Time: 0-120 sec.
Overall Dimensions: Auto-Dip 6035-TS
Base Unit:
850 mm W x 800 mm D x 550 mm H
(33.5" x 31.5" x 21.6")
Touchscreen Console:
400 mm W x 130 mm D x 280 mm H
(15.75" x 5.1" x 11")
6035-B Stand for Auto-Dip 6035
870 mm W x 820 mm D x 660-700 mm H
(34.25" x 32.3" x 26"-27.6")
Weight: Auto-Dip 6035-TS
Base Unit: 100 Kg (220 lbs.)
Touchscreen Console: 5 Kg (11 lbs.)
6035-B Stand for Auto-Dip 6035
27 Kg (60 lbs.)
Shipping Weight: Approx. 353 lbs. (160 kgs)
Power Requirements: 220V, Single Phase, 50/60 Hz, 40A, 7.2KW