Manncorp Auto-Dip 3530-TS Dip Soldering Machine

Model: Auto-Dip 3530-TS Dip Soldering Machine

Used
Details:
Auto-Dip 3530-TS Soldering System - Specifications
PCB Size: Finger-Type PCB Holder:
350 mm x 300 mm (13.8" x 11.8") max.
50 mm x 50 mm (1.9" x 1.9") min.
Pin-Type PCB Holder:
350 mm x 300 mm (13.8" x 11.8") max.
60 mm x 60 mm (2.4" x 2.4") min.
Solder Pot Size: 400 mm W x 340 mm D x 80 mm H
(15.75" x 13.4" x 3.15")
Solder Pot Capacity: approx. 70 Kg
(154 lbs.) Lead-Free SAC
approx. 85 Kg (187 lbs.) SnPb
Solder Pot Temperature: recommended 285 °C
(545 °F) Lead-Free SAC
recommended 265 °C (509 °F) SnPb
450 °C (842 °F) max.
Solder Dwell Time: 1-10 sec.
Preheat Time: 0-120 sec.
Overall Dimensions: Auto-Dip 3530-TS
Base Unit:
600 mm W x 750 mm D x 460 mm H
(23.6" x 29.5" x 18.1")
Touchscreen Console:
400 mm W x 120 mm D x 280 mm H
(15.75" x 4.7" x 11")
3530-B Stand for Auto-Dip 3530
620 mm W x 770 mm D x 660-700 mm H
(24.4" x 30.3" x 26"-27.6")
Weight: Auto-Dip 3530-TS
Base Unit: 78 Kg (172 lbs.)
Console: 5 Kg (11 lbs.)
3530-B Stand for Auto-Dip 3530
21 Kg (46.3 lbs.)
Shipping Weight: Approx. 287 lbs. (130 kgs)
Power Requirements: 220V
Single Phase, 50/60 Hz, 20A, 3.6KW