Essemtec

Essemtec MPL3100 Micro Placer

Prototyping, small batch, rework
Image overlay alignment system
Precies fine pitch placement
BGA and Micro-BGA placement
SMD placement systems for prototyping and low volumes

The Microplacer MPL3100 is a versatile placement machines for such applications. They allow highly accurate placement of modern components, such as BGA, Micro-BGA, CSP, Flip Chip and fine pitch QFP.

Ideal for components with high lead count
Suitable for very small components
Easy alignment by image overlay
High accuracy placement
Wide zoom range for CSP to QFP
Versatile substrate holder
Ease operation