Airvac Onyx-29 Automated BGA Rework system

Automated rework system with nozzle changer.

Precision Placement Accuracy :
Linear encoders and “worm gear” z-axis drive combine to
provide industry leading 9 micron placement accuracy with
no mechanical calibration ever!

Vision System :
Beam splitter, color camera with zoom lens and
programmable intensity LED’s green/top-white/bottom),
simplify the alignment process.

Options Installed :
Tool Changer (5 Pocket) #0029.14.010
• Automates nozzle/tool handling processes for removal,
site clean and
• replacement.

IR Sensor with Laser Pointer #0029.12.040
• Provides process repeatability by insuring the board is at
the exact same target
• temperature each time before localized reflow begins.
• The Laser Pointer provides a visual reference to
the center of the IR Sensor (non contact),
verifying position over the substrate.
• Can be programmed for automatic positioning.
• The IR Sensor monitors topside board temperature and
automatically triggers the localized reflow process once the
target temperature is reached.

Site Cleaning Kit (Standard Components) #1015.11.015
• Includes Standard Site Clean Nozzle/Tips and accessories
• Fully automated removal of residual solder without
damaging pads/solder mask.
• Eliminates the need for traditional solder iron/solder wick process and associated
• issues (ie. manual intervention, mechanical contact of pads).