Used Semiconductor Equipment

Plasma Etch Version: 150 mm Vintage: 01.06.1995 The equipment was operational in the wafer fab up until Augus Year(s) : 1995 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

High Current Implanter Version: 200 mm SMIF Vintage: 01.12.2000 : Current Status of tool: In cleanroom, idled Year(s) : 2000 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Version: 150 mm Vintage: 01.06.1992 The equipment was operational in the wafer fab up until August 2024. The Year(s) : 1992 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

General Product Information Vendor Supplier LINTECH Model RAD-3510F/12 Vintage 2012 Asset Description BSL900-T Year(s) : 2012 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Vendor Supplier RIGAKU Model TXRF-V300 Vintage 2007 Software Version 1.55 CIM SEC/GEM Process TXRF measurement Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Transaction Information Tool ID OP 922 Tool Status Connected Wafer Size 300 mm Fab Section Defect Detection Year(s) : 2007 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

OAI Model 806 MBA NUV 4" Mask Aligner is a four-camera, manual, optical backside mask aligner system that is d Location : AMERICA North (USA-Canada-Mexico)

Price : On request

DOM 6/2017 Per the OEM: As the true 3D AOI system, ZENITH LiTE effectively measures solder joints and compo Year(s) : 2017 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Manufacturer: ESEC Type: Smart Card Wire Bonder Model: ESEC 3100 SCplus Location : EUROPE (Western and Northern)

Price : On request

ICP-PECVD deposition system for solar wafers Version: 156 mm square (200 mm) Vintage: 01.06.2015 PECVD deposi Year(s) : 2015 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Microscope Model STM7-DI Year(s) : 2015 Location : ASIA (North East)

Price : On request

ion: Implanter Location : ASIA (North East)

Price : On request

wet: Spin etcher Location : ASIA (North East)

Price : On request

Condition Good Year of Manufacture 2011 Exterior Dimensions Width 49.213 in (125.0 cm) Depth 86.614 i Year(s) : 2011 Location : EUROPE (Western and Northern)

Price : On request

6 inch vintage: 1995 As-is condition Complete with no missing parts Working condition before decommissioned P Year(s) : 1995 Location : EUROPE (Western and Northern)

Price : On request

Tool Status Connected Wafer Size NA Fab Section Failure Analysis Asset Description Zeiss Merlin Scanning Ele Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

Common Features of All 7500 Series Systems • Compact benchtop design permits easy integration into existing la Year(s) : 2010 Location : EUROPE (Western and Northern)

Price : On request

CVD: MOCVD Location : ASIA (North East)

Price : On request

ion: Implanter Location : ASIA (North East)

Price : On request

Vendor Supplier DISCO Model DGP8761/Type DP Vintage 2018 Asset Description BSG903U1-TR DISCO DFM2800 Fully au Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Wafer Size 300 mm Fab Section Metrology General Product Information Vendor Supplier AMAT Model Verity1 SEM Vi Year(s) : 2005 Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Brand: AOI Systems Limited Type: In-line AOI Automated Optical Inspection The economic realities of quality c Location : AMERICA North (USA-Canada-Mexico)

Price : On request

Condition: good Exterior Dimensions Width 27.559 in (70.0 cm) Depth 27.559 in (70.0 cm) Height 76.3 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request

Condition Refurbished S-1160B-4N Precision Manual Analytical Probe Station configured with 4" chuck upgradable Location : EUROPE (Western and Northern)

Price : On request

Condition Good Exterior Dimensions Width 50.000 in (127.0 cm) Depth 86.614 in (220.0 cm) Height 74.0 Year(s) : 2004 Location : EUROPE (Western and Northern)

Price : On request